Stock Code:002962
Glass Cold Processing Technology
Semiconductor wafer
Technical Specifications
| 參數(shù)類(lèi)別 | 具體參數(shù) |
|---|---|
| 材料 | D263T/BF33//AF32/Corning7979/JGS1/SK1311/H-K509/H-ZF3/Sapphire/SiC 等 |
| 尺寸 | 2-12 英寸 |
| 厚度 | 150~1100 μm |
| 厚度公差 | ±1 μm |
| TTV | ≤0.5 μm |
| Warp | ≤15 μm |
| BOW | ≤10 μm |
| 粗糙度（ZYGO） | 0.1 nm |
| 角度精度 | / |
| PV (λ) | / |
| 外觀(guān)質(zhì)量 | 10/5 |
| 生產(chǎn)能力 | 10K wafer/month（10K 片 / 月） |
Stock Code:002962
- Service Phone
- 0716-8800009
- Fax Number
- 0512-63636268
- Address:No. 55 Shenzhen Avenue, Jingzhou Development Zone, Jingzhou City, Hubei Province
- Email:wfgw@w-olf.com
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